Cross sectional shape

Measure fine details on touch panels regardless of surface finish with confocal sensors. With a beam spot of 3.5μm, even the smallest features can be measured.

Profile tire treads and sidewalls with multiple 2D laser profilers.

Measure the step height of features on a wafer after etching. With 3D interferometry, mirrored surfaces can be measured accurately.

Using 2D thrubeam sensors, medical balloons can be inspected inline at high-speed.

Inspect for lamination misalignment after winding. With a minimum X-resolution of 2.5 μm 0.000098", the LJ-X8000 Series accurately measures the profile of each electrode.

Provide feedback about disconnected locations in electrodes before lamination. Accurately acquire the profile of electrode terminals to perform high-accuracy inspection of edge locations.

Measure the profile of a wafer edge. By selecting one of the inspection tools such as Height Difference/Width or Angle, users can start measurement easily. The high-resolution image capturing using 3200 points/profile achieves highly accurate profile measurement that was impossible with conventional methods.

Film curvature and wrinkling measurements are performed using a blue laser with a maximum width of 720 mm. Measurement is possible even for transparent targets thanks to the wide dynamic range of the CMOS sensor.