In the electronics and semiconductor industry, the trend over many decades has been to miniaturise components to satisfy the ever-increasing demand for wearable and mobile devices that have far more processing power than many desktop computers.
In the 21st century, miniaturisation enables a myriad of tiny yet functionality-packed integrated circuits (ICs) to be inserted on to a single PCB. However, one of the issues of working in these miniscule sizes has been the difficulty of research and development professionals checking prior to mass production whether on-board components meet the stringent quality requirements that ensure they will operate reliably and repetitively throughout the life of the device.
When working at such sizes, it’s possible for crucial defects to be invisible to R&D staff who carry out checks using traditional optical systems. Factors that could be missed include defects in the resist film or on a wafer’s edge, lack of uniformity in solder ball bonding used to connect flip chips, poor contacts in wire bonds and much more.
Clearly, the only way of looking so closely at such components to ensure they satisfy standards is through microscopy. However, when working with semiconductors it is important to obtain the most accurate measurements, to have access to pristine, fully detailed images, to be able to identify precisely what the problem is and to be able to communicate findings in an easily understandable format.
One significant issue for many R&D professionals working in this sector is that existing microscopes tend not to possess the depth of field required to generate the extremely clear image that they require. Also, microscopes will often need to be connected to a separate camera and to external software in order to process the images and communicate the results. In addition, R&D staff usually have to carry out preparation work before using several different microscopes – a 2D measurement microscope, a scanning electron microscope (SEM) and others. This preparation can be hugely time consuming and switching between microscopes can present logistical problems if the various microscopes are used by different teams in separate rooms.
The VK-X3000 3D Surface Profiler uses a triple scan approach, where laser confocal scanning, focus variation, and white light interferometry measurement methods are used, so that high-accuracy measurement and analysis can be performed on any target. The VK-X3000 has a resolution of 0.01 nm and can scan areas up to 50 × 50 mm (1.97″ × 1.97″), allowing for measurement of the overall shape of the target while still maintaining high-resolution for analysis of minute surface features. KEYENCE's new 3D Surface Profiler can handle any target, including those with transparent or mirrored surfaces, large height changes, or steep angles.
The VR-6000 optical profilometer performs non-contact measurement to replace stylus profilometers and roughness meters. This 3D profile system captures full surface data across the target with a resolution of 0.1 µm, enabling measurement of features that cannot be performed with probe-type instruments. The new rotational scanning greatly expands the measurement capabilities of the system. True-to-life cross section measurements can be performed with no blind spots. Wall thicknesses and recessed features can be measured without cutting or destroying the target. In addition, the HDR scanning algorithm provides enhanced scanning capabilities for instantly determining the optimal settings to capture high quality data, even on glossy and matte surfaces.
The VL-800 Series 3D Scanner CMM is the first in its lineup to feature 3D-AI, making high-quality 3D data acquisition and analysis effortless for any user. The system intelligently recommends optimal scanning, stitching, and measurement methods based on the shape of the part being analyzed. Additionally, scanned parts can be directly compared to their CAD models for quick visualization of differences, or the 3D scan can be used to streamline reverse engineering processes. From scanning to STEP file output, the VL-800 handles everything automatically, and provides accurate data in a format accessible by any CAD software.