Gap between a reticle and wafer
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Industry:
- Semiconductors/LCDs
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Products:
- Measurement Sensors
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The distance to a wafer is captured through a reticle to measure the gap. The SI-F Series lineup includes a sensor head that can be installed approximately 80 mm (3.15") away from targets. This allows for ultra-high-accuracy measurement at a resolution of 0.001 µm without interfering with components inside equipment.