Gap between a reticle and wafer

The distance to a wafer is captured through a reticle to measure the gap. The SI-F Series lineup includes a sensor head that can be installed approximately 80 mm (3.15") away from targets. This allows for ultra-high-accuracy measurement at a resolution of 0.001 µm without interfering with components inside equipment.

Micro-head Spectral-interference Laser Displacement Meter

SI-F series

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