Specs Spectral-Interference Wafer Thickness Meter SI-F80R series

Model		SI-F80R^*1
Image
Type		Wafer thickness measurement type Sensor head
Measurement range		10 to 310 µm 0.000394" to 0.0122" (when n=3.5)^*2
Possible detection distance		80 to 81.1 mm 3.15" to 3.19"
Light source		Infrared SLD Output 0.6 mW, Class 1 Laser Product (IEC60825-1, FDA (CDRH) Part 1040.10^*3)
Spot diameter		ø25 µm ø0.000984"^*4
Linearity		±0.1 µm ±0.000004" (when n=3.5)^*5
Resolution		0.001 µm ^*6
Sampling cycle		200 µs
LED display		Target near center of measurement range : green lights. Target within measurement range : orange lights. Target outside measurement range : flashes orange.
Temperature fluctuation		―
Environmental resistance	Enclosure rating	IP64
	Ambient light	Incandescent lamp or Fluorescent lamp: 10,000 lux max.
	Ambient temperature	0 to +50 °C 32 to 122 °F
	Relative humidity	35 to 85 % RH (No condensation)
	Vibration resistance	10 to 55 Hz, Double amplitude 1.5 mm 0.06", 2 hours in each of the X, Y, and Z directions
Material		SUS
Weight		Approx. 70 g (including cable)
^1 The sensor head and spectrum unit are calibrated as a pair. They are not interchangeable. ^2 Indicates the thickness measurement range when the refractive index is 3.5. (The thickness measurement range is 35 to 1100 µm0.001378" to 0.0433" when the refractive index is 1.) ^3 The laser classification for FDA (CDRH) is implemented based on IEC60825-1 in accordance with the requirements of Laser Notice. ^4 Indicates the minimum beam spot diameter within the measurement range. ^5 This value is obtained by measuring the gap between two glass plates with the number of averaging measurements set to 256, converted to a refractive index of 3.5. ^6 This value is obtained by measuring a 0.3 mm 0.01" thick glass target within the possible detection distance with the number of averaging measurements set to 4096.